Rogers to Exhibit High Performance Circuit Materials at IMS Show

Rogers Corp. is exhibiting at the 2016 IEEE International Microwave Symposium (IMS) May 24-26, at the Moscone Center in San Francisco, CA, booth #2039.

As part of the MicroApps Session, John Coonrod, Rogers’ Technical Marketing Manager, will lead two presentations on the proper selection of circuit materials for microwave frequencies and beyond.

Presentation #1: For those wishing to know more about incorporating flexible circuit materials into their next RF/microwave design, “High Frequency Circuits Which Bend and Flex” is Tuesday, May 24th, at 12:30 pm.

Presentation #2: For attendees interested in serving the growing demand for millimeter-wave circuits in such applications as automotive safety systems and Fifth Generation (5G) wireless systems, “Circuit Material Selection for Millimeter-Wave Applications, is Tuesday, May 24th, at 3:00 pm.

Visit booth #2039 to understand how Rogers Corporation is developing solutions needed to support the next generation network, 5G. Rogers advanced materials continue to be at the forefront of innovation – enhanced mobile broadband, mission critical services and massive IoT are some of the market segments where Rogers’ expertise is making tomorrow happen today.

As a founding member of the RF Energy Alliance, Rogers Corporation joined with a group of like-minded companies dedicated to realizing solid-state RF energy’s true potential as a clean, highly efficient and controllable heat and power source. Learn how The Alliance aims to reduce system cost and increase market adoption and growth through standardization of solid-state RF energy components, modules and application interfaces. Dr. Klaus Werner, Executive Director of RF Energy Alliance, will be available at the Rogers booth on Wednesday, May 25th, at 1PM to discuss this technology.

Rogers offers a variety of material options that are specifically engineered to help manage the thermal challenges that today’s RF engineers face. From PTFE based RT/duroid 6035HTC, TC350, and TC600 laminates to thermoset materials 92ML laminates and 92ML StaCool laminates, Rogers provides a large toolbox that offers many viable options.

RT/duroid 6035HTC laminates offer the highest performance available with a thermal conductivity of 1.44W/mK in combination with a super low loss of 0.0013 at 10GHz. TC350 and TC600 laminates offer an excellent combination of thermal conductivity (1.0-1.1W/mK), low loss (0.0020 at 10GHz), and cost effectiveness.

The 92ML series materials offer extreme thermal management in a lower cost modified epoxy based thermoset system with a high thermal conductivity (2.0W/mK), high Tg (160°C), and halogen free flame retardancy. The 92ML StaCool laminates are an Insulated Metal Substrate (IMS) version of the 92ML series laminate to enable the highest heat dissipation configuration available.

Rogers also offers COOLSPAN TECA adhesive as an option for designers to use when bonding heat sinks to board materials. COOLSPAN TECA modified epoxy assembly adhesive has a thermal conductivity of 6W/mK in a lead free capable, thermally stable system.

RO4835 laminates, with a dielectric loss tangent of 0.0037 at 10 GHz, are now available with Rogers proprietary LoPro reverse treat copper foil. These materials are suited for applications requiring low insertion loss characteristics. LoPro foil provides reduced electrical variability due to its smoother copper surface, maintaining consistent performance for reliable broadband signal delivery from Digital through RF and microwave frequencies.  In addition, RO4835 laminates provide 10 times improved oxidation resistance compared to RO4350B laminates.

Comments are closed.